University of illinois Urbana-Champaign

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High Strain Deformation of Flexible Integrated Circuit

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Media Details

Created 03/10/2009

Digital photograph captured by ITG staff Chas Conway in the Visualization Laboratory, highlighting the work of UIUC researchers John Rogers, Dae-Hyeong Kim, et al. The image reveals a bendable, stretchable integrated circuit under the stress of a pencil tip projected into the device. To capture the image, Conway constructed a custom device holder and an elaborate lighting setup using the Visualization Laboratory's macro-photography system.

Credits

  • John A. Rogers , 3D Micro- and Nanosystems, Beckman Institute
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