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Anisotropic Etching of a Bulk Silicon Wafer

Media Details

Created 01/18/2005

ESEM image of smooth sidewalls of single crystal silicon formed by anisotropic wet etching. The underlying Si was chemically etched anisotropically using KOH/H 2 O solution.

Credits

John A. Rogers , 3D Micro- and Nanosystems, Beckman Institute
Jong-Hyun Ahn , 3D Micro- and Nanosystems, Beckman Institute

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